The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2026
Filed:
Jun. 15, 2023
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Joongwon Shin, Suwon-si, KR;
Jongmin Lee, Suwon-si, KR;
Sungyun Woo, Suwon-si, KR;
Nara Lee, Suwon-si, KR;
Yeonjin Lee, Suwon-si, KR;
Jimin Choi, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); G01R 31/28 (2006.01); H01L 23/00 (2006.01); H01L 23/48 (2006.01); H01L 25/00 (2006.01); H01L 25/18 (2023.01); H10B 80/00 (2023.01);
U.S. Cl.
CPC ...
H01L 22/32 (2013.01); G01R 31/2896 (2013.01); H01L 23/481 (2013.01); H01L 24/05 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H10B 80/00 (2023.02); H01L 24/06 (2013.01); H01L 24/08 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2224/05555 (2013.01); H01L 2224/0557 (2013.01); H01L 2224/05611 (2013.01); H01L 2224/05616 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05639 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/05666 (2013.01); H01L 2224/06136 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/014 (2013.01);
Abstract
A semiconductor package, includes: a base chip having a front surface and a back surface opposite to the front surface, the base chip including bump pads, wafer test pads, and package test pads, disposed on the front surface; connection structures disposed on the front surface of the base chip and connected to the bump pads; and semiconductor chips stacked on the back surface of the base chip, wherein each of the wafer test pads is smaller than the package test pads.