This inventor holds 2 USPTO granted patents and 3 published patent applications and 2 EPO patents. Top assignee: Samsung Electronics Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Nara Lee: Innovator in Semiconductor Technology
Introduction
Nara Lee is a prominent inventor based in Suwon, South Korea. He has made significant contributions to the field of semiconductor technology, particularly through his innovative designs and patents. His work is instrumental in advancing the efficiency and functionality of semiconductor packages.
Latest Patents
Nara Lee holds a patent for "Semiconductor packages having test pads." This invention includes a base chip with a front surface and a back surface, featuring bump pads, wafer test pads, and package test pads on the front surface. The design incorporates connection structures on the front surface of the base chip, which are connected to the bump pads. Additionally, semiconductor chips are stacked on the back surface of the base chip, with each wafer test pad being smaller than the package test pads. This innovation enhances the testing and performance capabilities of semiconductor packages.
Career Highlights
Nara Lee is currently employed at Samsung Electronics Ltd., a leading global technology company. His role at Samsung allows him to work on cutting-edge semiconductor technologies, contributing to the company's reputation for innovation and excellence in the electronics industry.
Collaborations
Some of Nara Lee's coworkers include Jimin Choi and Yeonjin Lee, who collaborate with him on various projects within the semiconductor field. Their teamwork fosters a creative environment that drives technological advancements.
Conclusion
Nara Lee's contributions to semiconductor technology through his patent and work at Samsung Electronics Ltd. highlight his role as an influential inventor in the industry. His innovative designs continue to shape the future of semiconductor packages.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile