Sejong City, South Korea

Sungwoon Park

This inventor holds 1 USPTO granted patent. Top assignee: Asml Netherlands. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Sungwoon Park. Retrieved from https://idiyas.com/inventor/sungwoon-park

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 7.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Sungwoon Park and Patterning Process Configuration.

Introduction

Sungwoon Park is an inventor based in Sejong City, South Korea. His patent work addresses methods for configuring patterning processes by using the results of an earlier process.

Latest Patents

Park is associated with 1 patent, titled “Configuration of Patterning Process.” The method simulates a first patterning process using a design layout in a first orientation, producing contours that meet the layout’s design specification under a set of process-window conditions. It then configures a second patterning process using a second orientation, the first process-window conditions, and the first set of contours. Design variables, such as illumination or mask patterns, are adjusted until the second set of contours falls within a desired matching threshold of the first set.

Career Highlights

Park is associated with ASML Netherlands. His patent describes a way to use results from one patterning process to guide the configuration of another.

Collaborations

The provided information names Duan-Fu Stephen Hsu and Jinwoong Jeong as Park’s coworkers. It does not specify their roles in the patent or the nature of their collaboration.

Conclusion

Sungwoon Park’s patent focuses on matching patterning-process contours across different design orientations, using process-window results and adjustable design variables to guide configuration.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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