Paju-si, South Korea

SungHo Youn


Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 30(Granted Patents)


Company Filing History:


Years Active: 2013

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1 patent (USPTO):Explore Patents

Title: Innovations of SungHo Youn in Semiconductor Technology

Introduction

SungHo Youn is a notable inventor based in Paju-si, South Korea. He has made significant contributions to the field of semiconductor technology, particularly in the area of electromagnetic interference (EMI) shielding. His innovative work has led to the development of advanced semiconductor device packages that enhance performance and reliability.

Latest Patents

SungHo Youn holds a patent for a semiconductor device package with electromagnetic interference shielding. This patent describes a semiconductor device package that includes a substrate unit with a grounding element, a semiconductor device, a package body, and an EMI shield. The design allows for effective grounding of electromagnetic emissions, ensuring that the semiconductor device operates efficiently and without interference. This invention is crucial for improving the performance of electronic devices in various applications.

Career Highlights

SungHo Youn is associated with Advanced Semiconductor Engineering, Inc., where he continues to innovate in semiconductor packaging technology. His work has been instrumental in advancing the capabilities of semiconductor devices, making them more robust against external electromagnetic interference. With a focus on practical applications, Youn's inventions contribute to the ongoing evolution of electronic components.

Collaborations

SungHo Youn has collaborated with talented colleagues such as JaeSeon An and Jeong Woo Lee. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies in the semiconductor industry.

Conclusion

SungHo Youn's contributions to semiconductor technology, particularly through his patented innovations, highlight his role as a key figure in the field. His work not only enhances the functionality of electronic devices but also sets a foundation for future advancements in semiconductor packaging.

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