The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2013
Filed:
Apr. 29, 2009
Jaeseon an, Paju-Si, KR;
Jeong Lee, Paju-Si, KR;
Sangjin Cha, Paju-Si, KR;
Sungho Youn, Paju-Si, KR;
JaeSeon An, Paju-Si, KR;
Jeong Lee, Paju-Si, KR;
SangJin Cha, Paju-Si, KR;
SungHo Youn, Paju-Si, KR;
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Abstract
Described herein are semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes: (1) a substrate unit including a grounding element disposed adjacent to a periphery of the substrate unit and at least partially extending between an upper surface and a lower surface of the substrate unit; (2) a semiconductor device disposed adjacent to the upper surface of the substrate unit; (3) a package body disposed adjacent to the upper surface of the substrate unit and covering the semiconductor device; and (4) an EMI shield disposed adjacent to exterior surfaces of the package body. A periphery of the package body is laterally recessed, such that a connection surface of the grounding element is electrically exposed and electrically connected to the EMI shield. The grounding element provides an electrical pathway to ground electromagnetic emissions incident upon the EMI shield.