This inventor holds 3 USPTO granted patents. Top assignees: Samsung Electronics Co., Ltd., Samsung Electronics Ltd.. Active years: 2023-2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:

Years Active: 2023-2026
Title: Innovations of Sungbum Kim in Semiconductor Technology
Introduction
Sungbum Kim is a notable inventor based in Suwon-si, South Korea. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique semiconductor package design.
Latest Patents
Sungbum Kim holds 1 patent for a semiconductor package that features a semiconductor chip positioned within a cavity of a cover wiring structure. This patent provides a detailed description of a semiconductor package that includes a support wiring structure, a semiconductor chip placed on the support wiring structure, and a cover wiring structure that encapsulates the semiconductor chip. The design incorporates a filling member that fills the space between the support wiring structure and the cover wiring structure. Notably, the cover wiring structure contains a cavity that extends from its lower surface into the structure, accommodating the upper portion of the semiconductor chip. Additionally, the design features a first slot and a second slot, each with distinct widths, which communicate with the cavity and extend to opposite side surfaces of the cover wiring structure.
Career Highlights
Sungbum Kim is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His work at Samsung has allowed him to focus on advancing semiconductor technologies and contributing to innovative product designs.
Collaborations
One of his notable coworkers is Jiyong Park, with whom he has likely collaborated on various projects within the semiconductor field.
Conclusion
Sungbum Kim's contributions to semiconductor technology exemplify the innovative spirit of modern inventors. His patent reflects a significant advancement in semiconductor packaging, showcasing his expertise and commitment to technological progress.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile