The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 01, 2023
Filed:
Nov. 12, 2020
Samsung Electronics Co., Ltd., Suwon-si, KR;
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Abstract
A semiconductor package may include a lower package including a first substrate, a first semiconductor chip on the first substrate, and a first molding portion on the first substrate to cover the first semiconductor chip, an interposer substrate on the first semiconductor chip, a supporting portion between the interposer substrate and the first substrate to support the interposer substrate, a connection terminal connecting the interposer substrate to the first substrate, and an upper package on the interposer substrate. The upper package may include a second substrate, a second semiconductor chip on the second substrate, and a second molding portion on the second substrate to cover the second semiconductor chip.