Taichung, Taiwan

Sung-Yi Yang


Average Co-Inventor Count = 2.3

ph-index = 1


Company Filing History:


Years Active: 2017-2023

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6 patents (USPTO):

Title: **Innovative Contributions of Sung-Yi Yang**

Introduction

Sung-Yi Yang, based in Taichung, Taiwan, is a noteworthy inventor with a total of six patents to his name. His innovative work primarily focuses on advancements in substrate assembly and bonding methods, contributing significantly to the field of materials science and engineering.

Latest Patents

One of Sung-Yi Yang's latest patents is titled "Substrate assembly and method of bonding substrates." This invention features a substrate assembly that includes a first substrate, a second substrate, and a bonding member. The first substrate is characterized by a first surface-modified region that has distinct functionality compared to the remainder of the substrate. Similarly, the second substrate exhibits a second surface-modified region connected to the first through a physical interaction, with differing functionality from the rest of the substrate. This innovative arrangement allows for a cooperative definition of a space between the two substrates, within which the bonding member is strategically placed to bond them together effectively.

Career Highlights

Sung-Yi Yang has built a solid career at Taiwan Green Point Enterprises Co., Ltd., where he has played a pivotal role in the development and enhancement of substrate bonding technologies. His expertise and inventive approach have led to multiple patents that showcase his commitment to advancing industrial processes and improving material applications.

Collaborations

Throughout his career, Sung-Yi Yang has collaborated with talented colleagues, including Pao-Chuan Wang and Yi-Cheng Lin. Together, they have fostered a team-oriented environment that encourages innovation and the exchange of ideas, resulting in several successful projects and patents.

Conclusion

Sung-Yi Yang continues to influence the landscape of substrate technology with his inventive spirit and commitment to research. His work not only reflects his personal achievements but also contributes to the wider body of knowledge in engineering and materials science, enhancing productivity and efficiency in various applications.

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