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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10940472 B1

PDFFull Text
Date of Patent:
Mar. 09, 2021

Filed:

Oct. 31, 2018

Substrate assembly and method of bonding substrates

Applicant:

Taiwan Green Point Enterprises Co., Ltd., Taichung, TW;

Inventors:

Sung-Yi Yang, Taichung, TW;

Pao-Chuan Wang, Taichung, TW;

Assignee:

Taiwan Green Point Enterprises Co., Ltd., Taichung, TW;

Attorney:

Young Basile Hanlon & MacFarlane, P.C.

Primary Examiner:

Christine T Mui

Int. Cl.
CPC ...
B01L 3/00 (2006.01); B81C 3/00 (2006.01); B29C 65/00 (2006.01); B29C 65/16 (2006.01); B29C 65/82 (2006.01); B29C 65/14 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
B01L 3/502707 (2013.01); B29C 65/1616 (2013.01); B29C 65/1635 (2013.01); B29C 65/1658 (2013.01); B29C 65/8207 (2013.01); B29C 66/028 (2013.01); B29C 66/1122 (2013.01); B29C 66/53461 (2013.01); B29C 66/73175 (2013.01); B29C 66/73921 (2013.01); B81C 3/001 (2013.01); B01L 2200/12 (2013.01); B01L 2300/0816 (2013.01); B01L 2300/161 (2013.01); B29C 65/16 (2013.01); B29C 65/8215 (2013.01); B29C 66/71 (2013.01); B29C 66/8322 (2013.01); B29C 66/919 (2013.01); B29C 66/929 (2013.01); B29C 66/949 (2013.01); B29L 2031/756 (2013.01); B81B 2201/058 (2013.01); B81C 2201/019 (2013.01);
Abstract

A substrate assembly and a method of bonding substrates are disclosed. The method includes steps of: providing two substrate; subjecting a connecting surface of each of the substrates to surface-modifying treatment to form surface-modified region respectively on each of the connecting surfaces; contacting the substrates in such a manner that the substrates are connected with each other through a physical interaction between the surface-modified regions; and laser irradiating and melting a portion of each of the connecting surfaces to form a respective bonding region, and solidifying the melted bonding regions of the substrates to bond the substrates together.

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