The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 09, 2021

Filed:

Oct. 26, 2018
Applicant:

Taiwan Green Point Enterprises Co., Ltd., Taichung, TW;

Inventors:

Sung-Yi Yang, Taichung, TW;

Pao-Chuan Wang, Taichung, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B01L 3/00 (2006.01); B81B 7/00 (2006.01); B81C 3/00 (2006.01); B32B 3/30 (2006.01); B32B 3/26 (2006.01); B32B 27/08 (2006.01); B32B 7/12 (2006.01);
U.S. Cl.
CPC ...
B01L 3/502707 (2013.01); B01L 3/502715 (2013.01); B32B 3/266 (2013.01); B32B 3/30 (2013.01); B32B 7/12 (2013.01); B32B 27/08 (2013.01); B81B 7/0025 (2013.01); B81C 3/001 (2013.01); B01L 2200/12 (2013.01); B01L 2300/0816 (2013.01); B01L 2300/0883 (2013.01); B01L 2300/0887 (2013.01); B32B 2307/73 (2013.01); B81B 2201/05 (2013.01); B81B 2203/0338 (2013.01); B81B 2203/0353 (2013.01); B81C 2203/032 (2013.01);
Abstract

A substrate assembly includes a first substrate, a second substrate and a bonding member. The first substrate includes a first surface-modified region having a functionality different from that of a remainder region of the first substrate. The second substrate includes a second surface-modified region connected to the first surface-modified region through a physical interaction and having a functionality different from that of a remainder region of the second substrate. The first and second substrates cooperatively define a space therebetween. The bonding member is disposed within said space to bond said first and second substrates together. A method for bonding substrates is also disclosed.


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