Sung-Mao Li

Title: Innovations of Inventor Sung-Mao Li

Introduction

Sung-Mao Li is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 5 patents. His work focuses on innovative packaging solutions for semiconductor devices, which are crucial for modern electronics.

Latest Patents

One of his latest patents is the "Multi-moldings fan-out package and process." This invention describes a semiconductor device package that includes a semiconductor device, a conductive bump, and two encapsulants. The design ensures that the conductive bump is electrically connected to a conductive pad on the semiconductor device, enhancing the device's functionality and reliability. Another notable patent is the "Semiconductor device including electric and magnetic field shielding." This patent outlines a semiconductor device package that incorporates magnetic layers to protect electronic components from external interference, thereby improving performance.

Career Highlights

Sung-Mao Li has worked with several reputable companies in the semiconductor industry. He has been associated with Advanced Semiconductor Engineering, Inc. and Universal Scientific Industrial (Shanghai) Co., Ltd. His experience in these organizations has allowed him to develop and refine his innovative ideas in semiconductor packaging.

Collaborations

Throughout his career, Sung-Mao Li has collaborated with talented individuals such as Wei-Hsuan Lee and Chien-Yeh Liu. These collaborations have contributed to the advancement of semiconductor technologies and have fostered a spirit of innovation in the field.

Conclusion

Sung-Mao Li's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence the development of advanced electronic devices.