Busan, South Korea

Sung Joon Choi


 

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2022

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1 patent (USPTO):Explore Patents

Title: Innovations of Sung Joon Choi in Thermal Management

Introduction

Sung Joon Choi is a notable inventor based in Busan, South Korea. He has made significant contributions to the field of thermal management, particularly in automotive applications. His innovative approach has led to the development of a unique device aimed at enhancing the durability and performance of exhaust systems.

Latest Patents

Sung Joon Choi holds a patent for an "Exhaust manifold heat dissipation cover coupling device for thermal stress and vibration deflection." This device is designed to prevent wear on a heat dissipation cover that couples with an exhaust manifold. It effectively improves the durability of various components by attenuating multi-directional vibrations transmitted from the exhaust manifold. Additionally, it addresses thermal stress by flexibly accommodating thermal deformation, thus preventing damage from high temperatures. The device also minimizes frictional damage through a sliding component that dampens vibrations.

Career Highlights

Throughout his career, Sung Joon Choi has worked with prominent automotive companies, including Hyundai Motor Company and Kia Motors Corporation. His experience in these organizations has allowed him to apply his innovative ideas in practical settings, contributing to advancements in vehicle technology.

Collaborations

Sung Joon Choi has collaborated with talented individuals such as Jae Gi Sim and Seung Hoon Lee. These partnerships have fostered a creative environment that encourages the development of cutting-edge solutions in the automotive industry.

Conclusion

Sung Joon Choi's contributions to thermal management through his innovative patent demonstrate his commitment to enhancing automotive technology. His work not only improves the durability of vehicle components but also addresses critical issues related to thermal stress and vibration.

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