For the Inventor, By the Inventor

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Ulsan, South Korea

Hantec Technology Co., Ltd.

USPTO Granted Patents = 2

EPO Patents = 1

Forward Citations = 4

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8 inventors (with patents filed for the assignee):

Jung Hyeok Lim (2 out of 3 patents)

Jae Gi Sim (2 out of 8 patents)

Sung Joon Choi (1 out of 1 patent)

4. Yong Pyo Hong (1 out of 6 patents)

5. Seong Bin Moon (1 out of 1 patent)

6. Ki Hoon Son (1 out of 1 patent)

7. Seung Hoon Lee (1 out of 58 patents)

8. Sung Il Choi (1 out of 1 patent)

2 patents: Sort by Forward Citations

1. 11408323 - Exhaust manifold heat dissipation cover coupling device for thermal stress and vibration deflection (2022-08-09),

2. 10654424 - Composite panel for sound absorption and sound insulation (2020-05-19),

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USPTO Data Jan 1 1976 - Dec 30 2025

2 Patents

#58 in Ulsan

#3,608 in South Korea

Ulsan, South Korea

Hantec Technology Co., Ltd.

Forward Citations = 4

8 inventors:

Jung Hyeok Lim (2 out of 3 patents)

Jae Gi Sim (2 out of 8 patents)

Sung Joon Choi (1 out of 1 patent)

4. Yong Pyo Hong (1 out of 6 patents)

5. Seong Bin Moon (1 out of 1 patent)

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