Seoul, South Korea

Sung Jin Yun

USPTO Granted Patents = 5 

 

Average Co-Inventor Count = 5.9

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2016-2019

Loading Chart...
Loading Chart...
5 patents (USPTO):Explore Patents

Title: Innovations of Sung Jin Yun

Introduction

Sung Jin Yun is a prominent inventor based in Seoul, South Korea. He has made significant contributions to the field of materials science, particularly in the development of epoxy resin compositions and inorganic fillers. With a total of 5 patents to his name, Yun continues to push the boundaries of innovation in his industry.

Latest Patents

Yun's latest patents include groundbreaking work on an inorganic filler and epoxy resin composition. One of his notable inventions involves an inorganic filler included in an epoxy resin composition, which features a coating layer formed on its surface. This coating layer comprises at least two elements selected from carbon, nitrogen, and oxygen. Another significant patent focuses on an epoxy resin composition that includes boron nitride with a metal oxide film formed on it, which is utilized in printed circuit boards.

Career Highlights

Sung Jin Yun is currently associated with LG Innotek Co., Ltd., where he applies his expertise in materials science to develop innovative solutions. His work has not only advanced the company's product offerings but has also contributed to the broader field of electronics and materials engineering.

Collaborations

Yun has collaborated with several talented individuals in his field, including Jae Man Park and Gun Young Gil. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.

Conclusion

Sung Jin Yun's contributions to the field of materials science through his patents and collaborations highlight his role as an influential inventor. His work continues to inspire advancements in epoxy resin compositions and inorganic fillers, paving the way for future innovations.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…