The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2016
Filed:
Nov. 22, 2013
Applicant:
Lg Innotek Co., Ltd., Seoul, KR;
Inventors:
Geon Young Kil, Seoul, KR;
Myeong Jeong Kim, Seoul, KR;
Jae Man Park, Seoul, KR;
Jong Heum Yoon, Seoul, KR;
Jeung Ook Park, Seoul, KR;
Sung Jin Yun, Seoul, KR;
Jong Sik Lee, Seoul, KR;
Sang A. Ju, Seoul, KR;
Yeo Eun Yoon, Seoul, KR;
Assignee:
LG INNOTEK CO., LTD., Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/05 (2006.01); B32B 15/092 (2006.01); B32B 27/20 (2006.01); B32B 27/26 (2006.01); B32B 27/38 (2006.01); C08L 63/00 (2006.01); C08K 3/22 (2006.01); C08K 3/28 (2006.01); C08K 3/34 (2006.01); C08K 3/36 (2006.01); C08K 3/38 (2006.01); H05K 1/03 (2006.01); H01B 3/40 (2006.01); C08G 59/50 (2006.01); C08G 59/22 (2006.01); C08G 59/56 (2006.01); C09K 5/14 (2006.01); C08K 3/00 (2006.01); C08K 5/41 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0373 (2013.01); C08G 59/226 (2013.01); C08G 59/504 (2013.01); C08G 59/5033 (2013.01); C08G 59/56 (2013.01); C08K 3/22 (2013.01); C08L 63/00 (2013.01); C09K 5/14 (2013.01); H01B 3/40 (2013.01); H05K 1/056 (2013.01); C08G 2250/00 (2013.01); C08K 3/0033 (2013.01); C08K 5/41 (2013.01); C08K 2003/2227 (2013.01); C08L 2203/20 (2013.01); H05K 2201/0209 (2013.01);
Abstract
An epoxy resin composition according to an embodiment of the present invention includes an epoxy compound, a curing agent including diaminodiphenyl sulfone, and an inorganic filler.