Growing community of inventors

Seoul, South Korea

Sung Jin Yun

Average Co-Inventor Count = 5.92

ph-index = 1

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 1

Sung Jin YunJae Man Park (4 patents)Sung Jin YunGun Young Gil (3 patents)Sung Jin YunSe Woong Na (2 patents)Sung Jin YunJeung Ook Park (2 patents)Sung Jin YunJong Sik Lee (2 patents)Sung Jin YunJong Heum Yoon (2 patents)Sung Jin YunMyeong Jeong Kim (2 patents)Sung Jin YunSang A Ju (2 patents)Sung Jin YunJina Gu (2 patents)Sung Jin YunJin Hwan Kim (1 patent)Sung Jin YunHyuk Soo Lee (1 patent)Sung Jin YunIn Hee Cho (1 patent)Sung Jin YunHyun Gu Im (1 patent)Sung Jin YunYeo Eun Yoon (1 patent)Sung Jin YunSanga Ju (1 patent)Sung Jin YunThanh Kieu Giang (1 patent)Sung Jin YunJin A Gu (1 patent)Sung Jin YunGeon Young Kil (1 patent)Sung Jin YunSung Jin Yun (5 patents)Jae Man ParkJae Man Park (20 patents)Gun Young GilGun Young Gil (3 patents)Se Woong NaSe Woong Na (21 patents)Jeung Ook ParkJeung Ook Park (13 patents)Jong Sik LeeJong Sik Lee (13 patents)Jong Heum YoonJong Heum Yoon (10 patents)Myeong Jeong KimMyeong Jeong Kim (10 patents)Sang A JuSang A Ju (6 patents)Jina GuJina Gu (3 patents)Jin Hwan KimJin Hwan Kim (53 patents)Hyuk Soo LeeHyuk Soo Lee (49 patents)In Hee ChoIn Hee Cho (35 patents)Hyun Gu ImHyun Gu Im (12 patents)Yeo Eun YoonYeo Eun Yoon (5 patents)Sanga JuSanga Ju (3 patents)Thanh Kieu GiangThanh Kieu Giang (2 patents)Jin A GuJin A Gu (2 patents)Geon Young KilGeon Young Kil (1 patent)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Lg Innotek Co., Ltd. (5 from 5,362 patents)


5 patents:

1. 10392499 - Inorganic filler, epoxy resin composition including the same and light emitting element including insulating layer using the composition

2. 10280289 - Epoxy resin composite and printed circuit board comprising insulating layer using the same

3. 10231332 - Inorganic filler and epoxy resin composition including the same

4. 9462689 - Epoxy resin composition and printed circuit board including insulating layer using the epoxy resin composition

5. 9282637 - Epoxy resin compound and radiant heat circuit board using the same

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as of
12/6/2025
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