The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 08, 2016

Filed:

Aug. 16, 2013
Applicant:

Lg Innotek Co., Ltd., Seoul, KR;

Inventors:

Sung Jin Yun, Seoul, KR;

Hyuk Soo Lee, Seoul, KR;

In Hee Cho, Seoul, KR;

Jae Man Park, Seoul, KR;

Myeong Jeong Kim, Seoul, KR;

Jong Heum Yoon, Seoul, KR;

Jeung Ook Park, Seoul, KR;

Jong Sik Lee, Seoul, KR;

Gun Young Gil, Seoul, KR;

Thanh Kieu Giang, Suwon-si, KR;

Jin Hwan Kim, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/38 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); C08G 59/28 (2006.01); C08G 59/30 (2006.01); C08L 63/00 (2006.01); H05K 1/05 (2006.01); C08K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0373 (2013.01); C08G 59/28 (2013.01); C08G 59/30 (2013.01); C08K 3/0033 (2013.01); C08L 63/00 (2013.01); H05K 1/0203 (2013.01); H05K 1/056 (2013.01); H05K 2201/0209 (2013.01);
Abstract

There is provided an epoxy resin compound including an epoxy resin including a crystalline epoxy, a curing agent, and an inorganic filler. Also, there is provided a radiant heat circuit board including a metal plate, an insulating layer formed on the metal plate; and a circuit pattern formed on the insulating layer, in which the insulting layer is formed by curing an epoxy resin compound including an epoxy resin including a crystalline epoxy, a curing agent, and an inorganic filler.


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