Company Filing History:
Years Active: 2022-2023
Title: Innovations by Sung Jae Lim in Semiconductor Technology
Introduction
Sung Jae Lim is a notable inventor based in Incheon, South Korea, who has made significant contributions to the field of semiconductor technology. He holds 2 patents that showcase his innovative work in EMI shielding for semiconductor devices.
Latest Patents
One of Sung's latest inventions revolves around EMI shielding for flip chip packages with exposed die backsides. This semiconductor device integrates a substrate and a semiconductor die placed over it. An encapsulant is strategically deposited over the semiconductor die and substrate, leaving the surface of the semiconductor die exposed. The invention features a first shielding layer that includes a stainless steel layer in direct contact with the semiconductor die's surface, along with a copper layer positioned above it. In certain embodiments, the shielding may also encompass a protective layer on top of the copper layer. Additionally, one embodiment includes a heatsink bonded to the semiconductor die via a solder layer, as well as the option for a second shielding layer to be formed over the side surface of the semiconductor die.
Career Highlights
Sung Jae Lim is associated with Stats Chippac Pte. Ltd., a company known for its advancements in semiconductor packaging and testing solutions. His work has made a considerable impact on improving the performance and reliability of semiconductor devices, further enhancing the technology landscape.
Collaborations
Throughout his career, Sung has collaborated with talented professionals such as Dong Won Son and Byeonghoon Kim. These collaborations have contributed to innovative ideas and solutions in the semiconductor industry, demonstrating the power of teamwork in advancing technology.
Conclusion
Sung Jae Lim's contributions to the field of semiconductor technology, highlighted by his recent patents, underscore his role as an inventive force. His work continues to shape the future of electronic devices, ensuring better performance through enhanced EMI shielding solutions.
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