Stats Chippac Pte. Ltd.

Sung Jae Lim

SungWon Cho

ChangOh Kim

KyoungHee Park

Byeonghoon Kim

Sung Ho Choi

Dong Won Son

Jong Ho Shin

A semiconductor device has a substrate and a semiconductor die disposed over the substrate. An encapsulant is deposited over the semiconductor die and substrate with a surface of the semiconductor die exposed from the encapsulant. A first shielding layer is formed over the semiconductor die. In some embodiments, the first shielding layer includes a stainless steel layer in contact with the surface of the semiconductor die and a copper layer formed over the stainless steel layer. The first shielding layer may further include a protective layer formed over the copper layer. One embodiment has a heatsink bonded to the semiconductor die through a solder layer. A second shielding layer can be formed over a side surface of the semiconductor die.

Emi shielding for flip chip package with exposed die backside

EMI shielding for flip chip package with exposed die backside

Growing community of inventors

Incheon, South Korea

Sung Jae Lim