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Title: Innovations of Sung Hun Jung in Flexible Substrate Technology
Introduction
Sung Hun Jung is a notable inventor based in Seoul, South Korea. He has made significant contributions to the field of flexible substrate technology, holding a total of 3 patents. His work focuses on methods of manufacturing metal wiring buried in flexible substrates, which has implications for various applications in electronics.
Latest Patents
Sung Hun Jung's latest patents include innovative methods for manufacturing metal wiring buried flexible substrates using plasma technology. One of his patents discloses a method that involves pre-treating a substrate by irradiating plasma on its surface, followed by the formation of metal wiring on the pre-treated substrate. The process continues with the application of a curable polymer to create a buried polymer layer, which is then cured and separated from the substrate. This method enhances the performance of the metal wiring by reducing resistance and ensuring a clean separation from the substrate.
Another patent outlines a similar method but utilizes a sacrificial layer made of a polymer that is soluble in water or organic solvents. This approach allows for the easy removal of the sacrificial layer, facilitating the separation of the polymer layer from the substrate. Both methods aim to improve the efficiency and effectiveness of flexible substrates in electronic applications.
Career Highlights
Sung Hun Jung has worked with esteemed institutions such as the Korea Institute of Machinery and Materials and the Korea Institute of Machinery and Minerals. His experience in these organizations has contributed to his expertise in the field of flexible substrates and their manufacturing processes.
Collaborations
Throughout his career, Sung Hun Jung has collaborated with notable colleagues, including Jae Wook Kang and Do Geun Kim. These collaborations have likely enriched his research and development efforts in the field.
Conclusion
Sung Hun Jung's innovative work in flexible substrate technology showcases his commitment to advancing the field through his patented methods. His contributions are significant in enhancing the performance and manufacturing processes of electronic components.