The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 29, 2016
Filed:
Jul. 30, 2012
Jae Wook Kang, Gyeongsangnam-do, KR;
DO Geun Kim, Gyeongsangnam-do, KR;
Jong Kuk Kim, Gyeongsangnam-do, KR;
Sung Hun Jung, Seoul, KR;
Seunghun Lee, Gyeongsangnam-do, KR;
Jae Wook Kang, Gyeongsangnam-do, KR;
Do Geun Kim, Gyeongsangnam-do, KR;
Jong Kuk Kim, Gyeongsangnam-do, KR;
Sung Hun Jung, Seoul, KR;
Seunghun Lee, Gyeongsangnam-do, KR;
Korea Institute of Machinery and Minerals, Daejeon, KR;
Abstract
Disclosed are methods of manufacturing a metal wiring buried flexible substrate by using plasma and flexible substrates manufactured by the same. The method includes pre-treating a substrate by irradiating the plasma on the surface of the substrate (Step 1), forming a metal wiring on the pre-treated substrate in Step 1 (Step 2), forming a metal wiring buried polymer layer by coating a curable polymer on the substrate including the metal wiring formed thereon in Step 2 and curing (Step 3), and separating the polymer layer formed in Step 3 from the substrate in Step 1 (Step 4). The metal wiring may be inserted into the flexible substrate, and the resistance of the wiring may be decreased. The metal wiring may be clearly separated from the substrate, and impurities on the substrate surface may be clearly removed. The flexible substrate may be easily separated by applying only physical force.