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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9445504 B1

PDFFull Text
Date of Patent:
Sep. 13, 2016

Filed:

Apr. 19, 2012

Methods of manufacturing metal wiring buried flexible substrate and flexible substrates manufactured by the same

Applicants:

Jae Wook Kang, Gyeongsangnam-do, KR;

DO Geun Kim, Gyeongsangnam-do, KR;

Jong Kuk Kim, Gyeongsangnam-do, KR;

Sung Hun Jung, Seoul, KR;

Myungkwan Song, Ulsan, KR;

Dae Sung You, Gyeongsangnam-do, KR;

Chang Soo Kim, Gyeongsangnam-do, KR;

Kee Seok Nam, Gyeongsangnam-do, KR;

Inventors:

Jae Wook Kang, Gyeongsangnam-do, KR;

Do Geun Kim, Gyeongsangnam-do, KR;

Jong Kuk Kim, Gyeongsangnam-do, KR;

Sung Hun Jung, Seoul, KR;

Myungkwan Song, Ulsan, KR;

Dae Sung You, Gyeongsangnam-do, KR;

Chang Soo Kim, Gyeongsangnam-do, KR;

Kee Seok Nam, Gyeongsangnam-do, KR;

Assignee:

Korea Institute of Machinery and Materials, Daejeon, KR;

Attorney:

Fredrikson & Byron, P.A.

Primary Examiner:

Jeremy C Norris

Int. Cl.
CPC ...
H05K 3/00 (2006.01); H05K 3/10 (2006.01); H05K 1/02 (2006.01); H05K 3/20 (2006.01); H05K 1/03 (2006.01); H05K 3/24 (2006.01);
U.S. Cl.
CPC ...
H05K 3/0017 (2013.01); H05K 1/02 (2013.01); H05K 3/10 (2013.01); H05K 3/207 (2013.01); H05K 1/0393 (2013.01); H05K 3/246 (2013.01); H05K 2201/0376 (2013.01); Y10T 29/49156 (2015.01);
Abstract

Disclosed are a method of manufacturing a metal wiring buried flexible substrate and a flexible substrate manufactured by the same. The method includes coating a sacrificial layer including a polymer soluble in water or an organic solvent, or a photodegradable polymer on a substrate (Step 1), forming a metal wiring on the sacrificial layer in Step 1 (Step 2), forming a metal wiring buried polymer layer by coating a curable polymer on the sacrificial layer including the metal wiring formed thereon in Step 2 and curing (Step 3) and separating the polymer layer in Step 3 from the substrate in Step 1 by removing through dissolving in the water or the organic solvent or photodegrading only the sacrificial layer present between the substrate in Step 1 and the polymer layer in Step 3 (Step 4).

Find Patent Forward Citations

Kang, Jae. (2016). Methods of manufacturing metal wiring buried flexible substrate and flexible substrates manufactured by the same (U.S. Patent No. 9445504). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9445504

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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