Company Filing History:
Years Active: 2020-2021
Title: Innovations by Sung Hawn Bae in Semiconductor Packaging
Introduction
Sung Hawn Bae is a notable inventor based in Suwon-si, South Korea. He has made significant contributions to the field of semiconductor packaging, holding a total of 4 patents. His work is primarily associated with Samsung Electronics Co., Ltd., where he has been instrumental in developing advanced semiconductor technologies.
Latest Patents
Sung Hawn Bae's latest patents focus on innovative semiconductor packages. One of his patents describes a semiconductor package that includes a connection structure with opposing surfaces and a redistribution layer. It features a semiconductor chip on the first surface, encapsulated by a resin that can be opaque or translucent. Additionally, it includes a mark for identification carved into the encapsulant and a transparent passivation layer. Another patent outlines a similar semiconductor package, which also incorporates a connection structure and a semiconductor chip, but with a passivation layer that has multiple openings exposing regions of the redistribution layer.
Career Highlights
Throughout his career, Sung Hawn Bae has demonstrated a commitment to advancing semiconductor technology. His patents reflect a deep understanding of the complexities involved in semiconductor packaging and the importance of efficient design.
Collaborations
Sung Hawn Bae has collaborated with notable colleagues, including Jung Soo Kim and Pyung Hwa Han, contributing to the innovative environment at Samsung Electronics Co., Ltd.
Conclusion
Sung Hawn Bae's contributions to semiconductor packaging exemplify the innovative spirit of modern technology. His patents not only enhance the functionality of semiconductor devices but also pave the way for future advancements in the field.