The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 30, 2021
Filed:
Sep. 24, 2019
Samsung Electronics Co., Ltd., Suwon-si, KR;
Pyung Hwa Han, Suwon-si, KR;
Jung Soo Kim, Suwon-si, KR;
Won Choi, Suwon-si, KR;
Sung Hawn Bae, Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package includes: a connection structure having first and second surfaces opposing each other and including a redistribution layer; a semiconductor chip disposed on the first surface of the connection structure and having connection pads connected to the redistribution layer; an encapsulant disposed on the first surface of the connection structure, encapsulating the semiconductor chip, and including an opaque or translucent resin; a mark indicating identification information and carved in the encapsulant; and a passivation layer disposed on the encapsulant and including a transparent resin.