Sun Mi Kim

Title: Sun Mi Kim - Innovator in Semiconductor Technology

Introduction

Sun Mi Kim is a prominent inventor based in Kyounggi-do, South Korea. She has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. Her work focuses on innovative methods for enhancing semiconductor devices, particularly through the use of through silicon vias (TSVs).

Latest Patents

One of her latest patents is titled "Semiconductor device and method of forming topside and bottom-side interconnect structures around core die with TSV." This invention describes a semiconductor device that includes a core semiconductor device with a TSV. The core device comprises multiple stacked semiconductor dies and components. An insulating layer surrounds the core device, and a conductive via is formed through this layer. The invention features a first interconnect structure on one side of the core device, which is electrically connected to the TSV, and a second interconnect structure on the opposite side, also connected to the TSV. Both interconnect structures consist of several conductive layers separated by insulating layers, allowing for efficient electrical connections.

Career Highlights

Sun Mi Kim is currently employed at Stats Chippac Pte. Ltd., where she continues to advance her research and development in semiconductor technologies. Her innovative approaches have positioned her as a key player in her field.

Collaborations

Throughout her career, Sun Mi Kim has collaborated with notable colleagues, including OhHan Kim and KyungHoon Lee. These partnerships have fostered a collaborative environment that enhances the development of cutting-edge semiconductor solutions.

Conclusion

Sun Mi Kim's contributions to semiconductor technology through her patents and collaborations highlight her role as an influential inventor in the industry. Her work continues to pave the way for advancements in semiconductor devices, showcasing her dedication to innovation.