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For the Inventor, By the Inventor

Seoul, South Korea

Sun-Jung Lee

USPTO Granted Patents = 13

Average Co-Inventor Count = 3.9

ph-index = 5

Forward Citations = 277(Granted Patents)


Location History:

  • Seoul, KR (2003 - 2014)
  • Seongnam-si, KR (2014 - 2017)
  • Hwaseong-si, KR (2017 - 2019)

Company Filing History:

goldMedal9 out of 131,214 
 
Samsung Electronics Co., Ltd.
 patents
silverMedal2 out of 1,215 
 
Kt Corporation
 patents
bronzeMedal1 out of 24 
 
Samung Electronics Co., Ltd
 patents
4. 1 out of 379 
 
Intellectual Discovery Co., Ltd.
 patents

Years Active: 2003-2019

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13 patents (USPTO):
1. 10276675 - Integrated circuit device and method of manufacturing the same (2019-04-30),
2. 9972692 - Integrated circuit device and method of manufacturing the same (2018-05-15),
3. 9848278 - Digital device and method for providing additional service by using the same (2017-12-19),
4. 9786764 - Fin-FET semiconductor device with a source/drain contact having varying different widths (2017-10-10),
5. 8682303 - Digital device and method for providing additional service by using the same (2014-03-25),
6. 8626132 - Digital device and method for providing additional service by using the same (2014-01-07),
7. 8228069 - Test apparatus for determining if adjacent contacts are short-circuited and semiconductor integrated circuit devices that include such test apparatus (2012-07-24),
8. 8217393 - Test device, SRAM test device, semiconductor integrated circuit device and methods of fabricating the same (2012-07-10),
9. 7928002 - Method of forming wiring layer of semiconductor device (2011-04-19),
10. 7655525 - Semiconductor device free of gate spacer stress and method of manufacturing the same (2010-02-02),
11. 7488688 - Method of removing oxide layer and semiconductor manufacturing apparatus for removing oxide layer (2009-02-10),
12. 7446033 - Method of forming a metal interconnection of a semiconductor device, and metal interconnection formed by such method (2008-11-04),
13. 6607654 - Copper-plating elecrolyte containing polyvinylpyrrolidone and method for forming a copper interconnect (2003-08-19),
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