Sumit Kumar

Title: Innovations by Sumit Kumar

Introduction

Sumit Kumar is an accomplished inventor based in Phoenix, AZ. He has made significant contributions to the field of integrated circuit packaging. With a total of 2 patents to his name, his work is recognized for its innovative approach to technology.

Latest Patents

Sumit Kumar's latest patents include an integrated circuit package with spatially varied solder resist opening dimensions. This invention features a stack of integrated circuit (IC) packages that are interconnected by solder. The design incorporates solder resist openings (SRO) of mixed lateral dimensions that are spatially varied across the substrates. The SRO dimensions are adjusted based on the estimated gap between the substrates, which varies depending on the location within the substrate area. In cases where deflection in at least one substrate affects the conformality between the substrates, the invention provides a varying solder joint height from a fixed volume of solder. This is achieved by reducing the lateral dimensions of the SRO in areas with larger gaps compared to those with smaller gaps. The first substrate can be an IC chip, package substrate, or interposer, while the second substrate may be another IC chip, package substrate, interposer, or printed circuit board (PCB).

Career Highlights

Sumit Kumar is currently employed at Intel Corporation, where he continues to innovate and develop new technologies. His work has contributed to advancements in the field of electronics and integrated circuits.

Collaborations

Some of his notable coworkers include Tieyu Zheng and Renee D Garcia, who collaborate with him on various projects at Intel Corporation.

Conclusion

Sumit Kumar's contributions to integrated circuit packaging demonstrate his innovative spirit and commitment to advancing technology. His patents reflect a deep understanding of the complexities involved in electronic design and manufacturing.