Sudheer V Badana

Title: Sudheer V Badana: Innovator in Integrated Circuit Technology

Introduction

Sudheer V Badana is a prominent inventor based in Srikakulam, India. He has made significant contributions to the field of integrated circuits, particularly in the area of die-to-die interconnect technology. His innovative work has led to the development of a patent that enhances the testing architecture for three-dimensional integrated circuits.

Latest Patents

Sudheer V Badana holds a patent for a "Test architecture for die to die interconnect for three dimensional integrated circuits." This invention features a die-to-die repeater circuit that includes a transmit circuit coupled to a die-to-die interconnect. The transmit circuit incorporates at least one flip flop functioning as part of a linear feedback shift register (LFSR) to transmit values across the interconnect for design for test (DFT) purposes. This design ensures the proper operation of the die-to-die interconnect. Additionally, the receive circuit is also coupled to the die-to-die interconnect and includes at least one flip flop functioning as part of a multiple input shift register (MISR). This innovative approach significantly improves the reliability and efficiency of integrated circuits.

Career Highlights

Sudheer V Badana is currently employed at Intel Corporation, a leading technology company known for its advancements in semiconductor manufacturing. His role at Intel has allowed him to work on cutting-edge technologies and contribute to the development of innovative solutions in the field of integrated circuits.

Collaborations

Throughout his career, Sudheer has collaborated with notable colleagues, including Puneet Gupta and Amit D Sanghani. These collaborations have fostered an environment of innovation and have led to the successful development of various projects within the company.

Conclusion

Sudheer V Badana is a distinguished inventor whose work in integrated circuit technology has made a significant impact on the industry. His patent for die-to-die interconnect testing architecture exemplifies his commitment to innovation and excellence in engineering. His contributions continue to shape the future of integrated circuits and technology as a whole.