Stylianos Syrigos

Title: Stylianos Syrigos: Patent Contributions to Electronic Packaging

Introduction

Stylianos Syrigos is an inventor associated with Newport, Great Britain. His work includes patent contributions to electronic packaging and circuit-board technologies. He is associated with Microchip Technology Caldicot Limited and has 2 patents.

Latest Patents

Substrate with Embedded Conductive Coin. This invention describes a substrate, such as a printed circuit board, designed for an integrated circuit package. A conductive coin is embedded in a dielectric layer, with an embedded circuit component positioned above it in a cavity and conductively coupled to the coin. Additional dielectric and conductive layers, together with a via, provide an electrical connection to the component.

Electronic Device Package Including a Gel. This patent describes an electronic device package with a frame, a mounted electronic device, surface-mount leads, and gel that at least partially fills the cavity between the device and frame. The gel covers the device’s electronic circuitry, while the leads extend outward from the frame and connect electrically to the circuitry.

Career Highlights

Syrigos’s listed patent work addresses practical challenges in electronic packaging, including component integration, electrical connections, and protection of circuitry. His association with Microchip Technology Caldicot Limited connects his work to the electronics industry.

Collaborations

Syrigos’s listed coworkers include Piers Tremlett and Dan Chenery. Their shared professional context reflects collaboration within an electronics-focused organization.

Conclusion

Stylianos Syrigos’s two patents highlight his contributions to electronic device packaging, combining embedded circuit components, conductive structures, and protective materials.