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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12616059 B1

PDFFull Text
Date of Patent:
Apr. 28, 2026

Filed:

Oct. 10, 2022

Electronic device package including a gel

Applicant:

Microchip Technology Caldicot Limited, Caldicot, GB;

Inventors:

Piers Tremlett, Coleford, GB;

Dan Chenery, Newport, GB;

Stylianos Syrigos, Newport, GB;

Assignee:

Microchip Technology Caldicot Limited, Caldicot, GB;

Attorney:

SLAYDEN GRUBERT BEARD PLLC

Primary Examiner:

Omar F Mojaddedi

Int. Cl.
CPC ...
H01L 25/065 (2023.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/296 (2013.01); H01L 21/4839 (2013.01); H01L 21/4842 (2013.01); H01L 21/4875 (2013.01); H01L 21/56 (2013.01); H01L 23/3121 (2013.01); H01L 23/49838 (2013.01); H01L 23/49861 (2013.01); H01L 25/0655 (2013.01); H01L 24/48 (2013.01); H01L 2224/48011 (2013.01); H01L 2224/48095 (2013.01); H01L 2224/48155 (2013.01); H01L 2924/1616 (2013.01); H01L 2924/16251 (2013.01); H01L 2924/16315 (2013.01); H01L 2924/17151 (2013.01); H01L 2924/172 (2013.01); H01L 2924/173 (2013.01); H01L 2924/1815 (2013.01); H01L 2924/182 (2013.01); H01L 2924/186 (2013.01);
Abstract

An electronic device package includes a frame, an electronic device mounted to the frame, surface-mount leads, and a gel at least partially filling a cavity between the electronic device and the frame. The electronic device includes electronic circuitry provided on an electronic device substrate, and the surface-mount leads are electrically connected to the electronic circuitry and extend laterally and outwardly from an outer perimeter of the frame. The gel in the cavity covers the electronic circuitry.

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Tremlett, Piers. (2026). Electronic device package including a gel (U.S. Patent No. 12616059). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12616059

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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