Coleford, United Kingdom

Piers Tremlett

USPTO Granted Patents = 4 

Average Co-Inventor Count = 2.6

ph-index = 1

Forward Citations = 7(Granted Patents)


Company Filing History:


Years Active: 2014-2025

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4 patents (USPTO):Explore Patents

Title: Piers Tremlett: Innovator in Integrated Circuit Packaging

Introduction

Piers Tremlett is a notable inventor based in Coleford, GB. He has made significant contributions to the field of integrated circuit packaging, holding a total of 4 patents. His innovative designs have advanced the technology used in electronic devices, making them more efficient and compact.

Latest Patents

One of Tremlett's latest patents is for an embedded circuit package. This invention involves a substrate with a patterned conductor layer that defines bond pads. Components with upwardly facing contact pads are mounted on the substrate, and the contact pads are wire bonded to the bond pads. A series of layers, which may be fiberglass or thermoplastic, form a solid stack containing cavities for the components and associated wires.

Another significant patent is for an integrated circuit package. This design features a host integrated circuit with an active front side that is surface-mounted on a support. Conductive pathways extend between the front and back sides of the integrated circuit, with a redistribution layer on the back providing conductive traces and contact pads. This allows for a compact three-dimensional structure, enhancing the overall efficiency of the device.

Career Highlights

Piers Tremlett has been instrumental in the development of advanced semiconductor technologies. He works at Microsemi Semiconductor Limited, where he continues to innovate and push the boundaries of integrated circuit design. His work has been recognized for its impact on the industry, particularly in enhancing the performance of electronic devices.

Collaborations

Tremlett has collaborated with notable colleagues such as Michael Anthony Higgins and Martin McHugh. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Piers Tremlett's contributions to integrated circuit packaging demonstrate his commitment to innovation in the semiconductor industry. His patents reflect a deep understanding of technology and a drive to improve electronic devices. Through his work, he continues to influence the future of electronics.

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