The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2026
Filed:
Oct. 17, 2023
Microchip Technology Caldicot Limited, Caldicot Monmouthshire, GB;
George Taylor, Wales, GB;
Stylianos Syrigos, Newport, GB;
Microchip Technology Caldicot Limited, Caldicot Monmouth, GB;
Abstract
A substrate (e.g., a printed circuit board) for use in an integrated circuit package includes a first dielectric layer, a conductive coin embedded in the first dielectric layer, a first conductive layer formed on a first side of the first dielectric layer, a cavity in the first conductive layer, the cavity located over the conductive coin, and an embedded circuit component arranged in the cavity in the first conductive layer, wherein the embedded circuit component is located over the conductive coin and conductively coupled to the conductive coin. The substrate also includes a second dielectric layer formed over the first conductive layer, a second conductive layer formed over the second dielectric layer, and a via extending through the second dielectric layer, the via electrically connecting the second conductive layer to the embedded circuit component.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile