Boise, ID, United States of America

Steven W Heppler


Average Co-Inventor Count = 4.3

ph-index = 6

Forward Citations = 345(Granted Patents)


Company Filing History:


Years Active: 1993-2013

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10 patents (USPTO):Explore Patents

Title: Innovator Spotlight: Steven W Heppler - Revolutionizing Electronic Devices

Introduction:

Steven W Heppler, a prolific inventor based in Boise, ID, has made significant contributions to the world of electronic devices. With an impressive portfolio of 10 patents to his name, Heppler's innovative work at Micron Technology Incorporated has been instrumental in shaping the landscape of image sensor packaging structures.

Latest Patents:

Heppler's latest patents showcase his expertise in developing moisture-resistant image sensor packaging structures. These patents encompass various embodiments for molding tools, housing structures, and assembly methods that enhance the durability and functionality of electronic devices. The image sensor packages devised by Heppler include features such as interposers, housing structures, transparent covers, and sealed wire bond connections or flip-chip connections for efficient electrical connections.

Career Highlights:

As a key figure at Micron Technology Incorporated, Steven W Heppler has played a crucial role in advancing the field of electronic device packaging. His innovative solutions have set new standards for moisture resistance and durability in image sensor packages, demonstrating his commitment to excellence and ingenuity in the industry.

Collaborations:

Throughout his career, Heppler has collaborated closely with talented individuals in the field. Notable coworkers such as Todd O Bolken and Cary J Baerlocher have worked alongside Heppler, contributing their expertise to joint projects and further enriching the innovative culture at Micron Technology Incorporated.

Conclusion:

In conclusion, Steven W Heppler stands out as a visionary inventor whose groundbreaking work in electronic devices has earned him a reputation as a trailblazer in the industry. With a track record of 10 patents and a dedication to pushing the boundaries of technological innovation, Heppler continues to inspire and drive progress in the field of image sensor packaging structures.

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