The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 19, 2000
Filed:
Feb. 23, 1998
Tom A Muntifering, Boise, ID (US);
Steven W Heppler, Boise, ID (US);
Michael B Ball, Boise, ID (US);
Micron Technology, Inc., Boise, ID (US);
Abstract
The present invention relates to a process for preparing a wafer for chip packaging that minimizes stress and torque on wafer components during back grinding. The wafer has fabricated thereon a plurality of dies in a die side thereof opposite a back side thereof. A protective coating is spun on the die side to protect the dies. The wafer is separated into a plurality of connected pieces by scratching or cutting a recess into streets or scribe lines in the die side. The connected pieces of the wafer are secured to a surface with the back side thereof exposed. Material is removed from the back side of the wafer by chemical, mechanical, or chemical-mechanical methods until each piece is separated or disconnected from the other pieces. The protective coating is removed. The pieces can be situated upon a flexible surface that is stretched to increase the separation between pieces. Each die in the die side of each piece is then packaged into a die package.