Steven R Rivet

Title: Innovator Spotlight: Steven R. Rivet

Introduction

Steven R. Rivet is a notable inventor based in Malabar, Florida, who has made significant contributions to the field of electronics. With four patents to his name, Rivet has proven to be a key player in advancing technology through innovative design and engineering solutions.

Latest Patents

Among his latest patents, Rivet has developed a "Method of Fabricating a Circuit Module." This invention describes a circuit module that includes various electronic components supported by a single-layer conductive package substrate. The substrate is intricately designed with a peripheral portion featuring multiple peripheral contact pads, as well as an interior portion with floating contact pads that are electrically isolated.

Another significant patent by Rivet is for "Back-to-Back Stacked Dies." This invention addresses a circuit configuration that involves a first die, which is flip-chip mounted to a carrier, with a second die stacked on its backside. This unique arrangement allows for enhanced functionality and efficiency in electronic circuits.

Career Highlights

Steven Rivet is currently employed at Intersil Americas Inc., where he leverages his expertise in electronics and patent development. His innovative work has not only contributed to the success of the company but has also pushed the boundaries of what is possible in electronics.

Collaborations

Throughout his career, Rivet has worked alongside talented professionals, including Michael W. Althar and Francois Hebert. These collaborations have helped to amplify his impact in the field, leading to groundbreaking innovations and advancements in electronic technologies.

Conclusion

Steven R. Rivet’s dedication to innovation is evident through his multiple patents and contributions to electronic design. His continued work at Intersil Americas Inc. positions him as a leading figure in the industry, inspiring future inventors and paving the way for new technological advancements.