The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2020
Filed:
Jul. 21, 2017
Intersil Americas Llc, Milpitas, CA (US);
Jian Yin, San Jose, CA (US);
Nikhil Kelkar, Saratoga, CA (US);
Loyde M. Carpenter, Jr., Palm Bay, FL (US);
Nattorn Pongratananukul, San Jose, CA (US);
Patrick J. Selby, Palm Bay, FL (US);
Steven R. Rivet, Malabar, FL (US);
Michael W. Althar, Melbourne, FL (US);
Intersil Americas LLC, Milpitas, CA (US);
Abstract
A circuit module includes a plurality of electronic components and a single-layer conductive package substrate. The single-layer conductive package substrate is adapted to physically support and electrically interconnect the electronic components. The substrate has a peripheral portion and an interior portion. The peripheral portion includes a plurality of peripheral contact pads coupled to corresponding electronic components. The interior portion includes a plurality of floating contact pads that are electrically isolated from the peripheral contact pads and are coupled to corresponding electronic components.