The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 20, 2016

Filed:

Jan. 26, 2012
Applicants:

Francois Hebert, San Mateo, CA (US);

Steven R. Rivet, Malabar, FL (US);

Michael Althar, Melbourne, FL (US);

Peter Oaklander, Saratoga, CA (US);

Inventors:

Francois Hebert, San Mateo, CA (US);

Steven R. Rivet, Malabar, FL (US);

Michael Althar, Melbourne, FL (US);

Peter Oaklander, Saratoga, CA (US);

Assignee:

Intersil Americas LLC, Milpitas, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 43/00 (2006.01); H01L 25/16 (2006.01); H01L 23/373 (2006.01); H01L 23/433 (2006.01); H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/64 (2006.01);
U.S. Cl.
CPC ...
H01L 25/16 (2013.01); H01L 23/3732 (2013.01); H01L 23/4334 (2013.01); H01L 23/49575 (2013.01); H01L 24/49 (2013.01); H01L 23/3107 (2013.01); H01L 23/49562 (2013.01); H01L 23/645 (2013.01); H01L 24/16 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/05553 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/291 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32013 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/45014 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/49111 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83801 (2013.01); H01L 2224/83855 (2013.01); H01L 2224/92247 (2013.01); H01L 2225/06558 (2013.01); H01L 2924/01015 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/12032 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13064 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/181 (2013.01); Y10T 29/49121 (2015.01);
Abstract

Embodiments disclosed herein provide for a circuit including first die having an active side and a backside, wherein the first die is flip-chip mounted to a carrier. The circuit also includes a second die stacked on the backside of the first die, wherein the second die is stacked on the first die such that a backside of the second die is facing the backside of the first die and an active side of the second die faces away from the first die.


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