Malden, MA, United States of America

Steven M Lord

This inventor holds 4 USPTO granted patents. Top assignee: Proconics International, Inc.. Active years: 1985-1992.


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 4

Forward Citations = 70(Granted Patents)


Company Filing History:


Years Active: 1985-1992

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4 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Steven M. Lord

Introduction

Steven M. Lord is a notable inventor based in Malden, MA (US). He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on improving the efficiency and reliability of wafer transfer processes.

Latest Patents

Among his latest patents is a wafer transfer apparatus designed for inserting a semiconductor wafer into a slot of a holding post. This apparatus includes a wafer support member or paddle that supports the wafer and a rotation device that rotates the support member to ensure the edges of the wafer are properly aligned with the centers of the slots. Another notable patent is a wafer transfer apparatus that features a wafer-pickup element with suction openings positioned closer to the edge of the wafer than its center. This design enhances the certainty of picking up the wafer, especially warped ones, by utilizing raised portions around the openings to facilitate the process.

Career Highlights

Steven M. Lord is currently employed at Proconics International, Inc., where he continues to innovate in the semiconductor industry. His expertise and inventions have contributed to advancements in wafer handling technology, making processes more efficient and reliable.

Collaborations

One of his notable coworkers is Richard F. Foulke, with whom he has likely collaborated on various projects within the company.

Conclusion

Steven M. Lord's contributions to semiconductor technology through his patents and work at Proconics International, Inc. highlight his role as an influential inventor in the field. His innovative designs continue to shape the future of wafer transfer processes.

Profile summary based on public USPTO records.
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