Boise, ID, United States of America

Steven L Hamren

This inventor holds 23 USPTO granted patents, primarily in Semiconductor Processing. Top assignees: Micron Technology Incorporated, Other. Active years: 1998-2008.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Steven L Hamren. Retrieved from https://idiyas.com/inventor/steven-l-hamren

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 47.8

Average Co-Inventor Count = 1.4

ph-index = 6

Forward Citations = 305(Granted Patents)


Company Filing History:


Years Active: 1998-2008

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Areas of Expertise:
Electronic Component Assemblies
Semiconductor Devices
Conductive Bump Array
Testing Methods
Mirrored Terminal Arrangements
Compliant Contactor
High Frequency Contactor
Integrated Circuit Shipping
23 patents (USPTO):Explore Patents

Title: **Innovative Contributions of Steven L. Hamren in Semiconductor Technology**

Introduction

Steven L. Hamren, a prominent inventor based in Boise, ID, has made significant strides in the field of semiconductor technology. With a remarkable portfolio of 23 patents, his work focuses on enhancing the efficiency and effectiveness of electronic component assemblies.

Latest Patents

Hamren's latest patents showcase his innovative approaches, particularly in the handling and testing of semiconductor devices. One notable invention involves electronic component assemblies with electrically conductive bonds, which provide improved methods for semiconductor device management. This embodiment features a die carrier designed for semiconductor dice with very fine pitch electrical input/output elements. By temporarily attaching the semiconductor dice to the die carrier, testing can be conducted using conventional contact technology. His advancements also include a flex circuit base substrate paired with a rigid support frame, along with various materials for establishing temporary electrical connections during testing. The materials range from conductive films and tapes to resin-based adhesives and water-soluble conductive fillers.

Another significant patent by Hamren involves methods for processing semiconductor devices in a singulated form, again enhancing the functionality of his previously mentioned die carrier design. These innovations reflect his commitment to improving semiconductor technology and testing efficiency.

Career Highlights

Throughout his career, Steven L. Hamren has been associated with notable companies, including Micron Technology Incorporated. His tenure at such organizations has allowed him to apply his innovative ideas and contribute to the advancement of semiconductor technologies.

Collaborations

Hamren has collaborated with esteemed colleagues such as Daniel Cram and James P. Nuxoll. These partnerships have likely enriched his work and expanded the impact of his patents in the industry.

Conclusion

In summary, Steven L. Hamren's contributions to the field of semiconductor technology through his 23 patents exemplify the spirit of innovation. His latest projects focus on improving the testing and handling of semiconductor devices, demonstrating his commitment to pushing the boundaries of technology. As he continues to develop transformative solutions, Hamren remains a key figure in advancing electronic component assemblies.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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