Micron Technology Incorporated

Other

Steven L Hamren

Daniel Cram

James P Nuxoll

Justin L Lawrence

Leland R Nevill

William C Layer

Gregory A Barnett

Improved methods and apparatus are provided for the handling and testing of semiconductor devices. One embodiment comprises a die carrier for one or more semiconductor dice having very fine pitch electrical I/O (input/output) elements. The semiconductor dice are temporarily attached to the die carrier in singulated form to enable testing the dice with conventional contact technology. The die carrier may include a flex circuit base substrate and a rigid support frame. Further embodiments comprise materials and methods for attaching the semiconductor dice to the die carrier and for providing a temporary electrical connection with the semiconductor dice during testing. Exemplary materials for providing the temporary electrical connection may comprise a conductive film or tape, a conductive or conductor-filled epoxy, resin or RTV adhesive-based materials, a water-soluble material impregnated with a conductive filler or non-reflowed solder paste.

Electronic component assemblies with electrically conductive bonds

Methods for processing semiconductor devices in a singulated form

Method and apparatus for processing semiconductor devices in a singulated form

Apparatus for processing semiconductor devices in a singulated form

Method for processing semiconductor devices in a singulated form

A carrier for semiconductor components, and a method and system for handling semiconductor components using the carrier, are provided. The carrier includes a frame having component mounting sites that include adhesive members for retaining the components on the carrier. The adhesive members can include one or more pieces of polymer tape having low tack adhesive surfaces for retaining the components, and high tack adhesive surfaces for bonding to the carrier. The low tack adhesive surfaces are formulated to provide adhesive forces sufficient to retain the components on the component mounting sites, but low enough to allow a conventional pick and place vacuum tool to remove the components from the carrier. The adhesive forces on the components are determined by a contact area between the components and low tack adhesive surfaces, and by adhesive qualities of the low tack adhesive surfaces.

Method and system for handling semiconductor components

Carrier, method and system for handling semiconductor components

The present invention is directed toward conductive bump array contactors having an ejector and methods for testing bumped devices using such apparatus. In one aspect of the invention, an apparatus includes a base having a plurality of contact elements projecting therefrom, an ejector coupled to the base and moveable with respect to the base between a first position proximate the base and a second position spaced apart from the base, and an actuating device coupled to the base and to the ejector that asserts a force on the ejector. The biasing force is sufficient to overcome a sticking or attractive force that may develop between the conductive bumps and the contact elements. In one embodiment, the contact elements project into a single opening defined by the ejector. Alternately, the ejector includes a plurality of apertures, each contact element at least partially projecting into one of the apertures.

Conductive bump array contactors having an ejector and methods of testing using same

The present invention is directed toward conductive bump array contactors having an ejector and methods for testing bumped devices using such apparatus. In one aspect of the invention, an apparatus includes a base having a plurality of contact elements projecting therefrom, an ejector coupled to the base and moveable with respect to the base between a first position proximate the base and a second position spaced apart from the base, and an actuating device coupled to the base and to the ejector that asserts a force on the ejector. The biasing force is sufficient to overcome a sticking or attractive force that may develop between the conductive bumps and the contact elements. In one embodiment, the contact elements project into a single opening defined by the ejector. Alternately, the ejector includes a plurality of apertures, each contact element at least partially projecting into one of the apertures. Each aperture may have a receiving end sized to at least partially receive one of the conductive bumps to provide improved alignment of the conductive bumps with the contact elements. In yet another aspect, a method of testing a bumped device includes providing a base having a plurality of contact elements projecting therefrom, positioning an ejector at least partially between the base and the bumped device, aligning the array of conductive bumps with the plurality of contact elements, applying an engaging force to the bumped device to move the ejector toward the base and to move the conductive bumps into contact with the contact elements, transmitting test signals to the bumped device through at least some of the contact elements, and releasing the engaging force from the bumped device to allow the ejector to disengage the conductive bumps from the contact elements.

Disclosed are semiconductor devices having terminal arrangements in which mirrored pairs of the semiconductor devices can be tested by a common test device.

Semiconductor devices having mirrored terminal arrangements, devices including same, and methods of testing such semiconductor devices

The present invention is directed toward conductive bump array contactors having an ejector and methods for testing bumped devices using such apparatus. In one aspect of the invention, an apparatus includes a base having a plurality of buckle beam probes projecting therefrom, an ejector including a magnet coupled to the base and moveable with respect to the base between a first position proximate the base and a second position spaced apart from the base, and an actuating device coupled to the base and to the ejector that asserts a force on the ejector. The biasing force is sufficient to overcome a sticking or attractive force that may develop between the conductive bumps and the buckle beam probes. In one embodiment, the buckle beam probes project into a single opening defined by the ejector. Alternately, the ejector includes a plurality of apertures, each buckle beam probe at least partially projecting into one of the apertures.

The present invention is directed toward conductive bump array contactors having an ejector and methods for testing bumped devices using such apparatus. In one aspect of the invention, an apparatus includes a base having a plurality of spring probes projecting therefrom, an ejector including a coil spring coupled to the base and moveable with respect to the base between a first position proximate the base and a second position spaced apart from the base, wherein the ejector comprises a partially electrically-conductive material that inhibits the formation of an electro-static charge, and an actuating device coupled to the base and to the ejector that asserts force on the ejector. The biasing force is sufficient to overcome a sticking or attractive force that may develop between the conductive bumps and the spring probes. In one embodiment, the spring probes project into a single opening defined by the ejector. Alternately, the ejector includes a plurality of apertures, each spring probe at least partially projecting into one of the apertures.

Growing community of inventors

Boise, ID, United States of America

Steven L Hamren