Chandler, AZ, United States of America

Steve W Greathouse


Average Co-Inventor Count = 2.8

ph-index = 2

Forward Citations = 35(Granted Patents)


Company Filing History:


Years Active: 2002-2008

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3 patents (USPTO):Explore Patents

Title: Steve W Greathouse: Innovator in MEMS Technology

Introduction

Steve W Greathouse is a notable inventor based in Chandler, AZ (US). He has made significant contributions to the field of Micro-Electro-Mechanical Systems (MEMS) technology. With a total of 3 patents to his name, Greathouse has been instrumental in advancing the capabilities of MEMS devices.

Latest Patents

Greathouse's latest patents include innovative methods for MEMS packaging. One of his patents focuses on MEMS packaging using a non-silicon substrate for encapsulation and interconnection. In this invention, a MEMS die is bonded to a cap, which is non-silicon and features an electrical via extending from one side to the other. This design allows for a plurality of caps to be wafer bonded to multiple MEMS dice. Another significant patent involves wafer-level packaging of electronic devices before singulation. This method supports a plurality of active electronic components on a first wafer and shapes a second wafer to define spaces for each component. The second wafer is then aligned and bonded to the first wafer, enhancing the efficiency of the packaging process.

Career Highlights

Steve W Greathouse is currently employed at Intel Corporation, where he continues to push the boundaries of MEMS technology. His work at Intel has allowed him to collaborate with some of the brightest minds in the industry, contributing to the advancement of electronic devices.

Collaborations

Throughout his career, Greathouse has worked alongside talented colleagues, including John Heck and Joseph S Hayden, III. These collaborations have fostered an environment of innovation and creativity, leading to groundbreaking advancements in MEMS technology.

Conclusion

Steve W Greathouse is a prominent figure in the field of MEMS technology, with a focus on innovative packaging solutions. His contributions through patents and collaborations at Intel Corporation highlight his commitment to advancing electronic device capabilities.

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