The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 06, 2008
Filed:
Jun. 30, 2003
Applicants:
John Heck, Palo Alto, CA (US);
Joseph S. Hayden, Iii, Sunnyvale, CA (US);
Steve W. Greathouse, Chandler, AZ (US);
Daniel M. Wong, Fremont, CA (US);
Inventors:
John Heck, Palo Alto, CA (US);
Joseph S. Hayden, III, Sunnyvale, CA (US);
Steve W. Greathouse, Chandler, AZ (US);
Daniel M. Wong, Fremont, CA (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract
A MEMS die is bonded to a cap to form a MEMS device. The cap is non-silicon and has an electrical via extending from one side of the cap to another side of the cap. In one embodiment, a plurality of caps is wafer bonded to a plurality of MEMS dice.