Joseph S Hayden, Iii

Title: Joseph S. Hayden, III: Innovator in MEMS Technology

Introduction

Joseph S. Hayden, III is a prominent inventor based in San Francisco, CA. He has made significant contributions to the field of micro-electromechanical systems (MEMS) technology. With a total of 4 patents to his name, Hayden has been instrumental in advancing the capabilities of MEMS devices.

Latest Patents

Hayden's latest patents include innovative designs that enhance the functionality and efficiency of MEMS devices. One of his notable inventions is a MEMS packaging method that utilizes a non-silicon substrate for encapsulation and interconnection. In this design, a MEMS die is bonded to a cap, which is made of a non-silicon material and features an electrical via extending from one side to the other. This approach allows for improved integration and performance of MEMS devices.

Another significant patent is for a MEMS RF switch module that includes a vertical via. This invention provides a method to create a MEMS radio frequency switch module that effectively couples a MEMS die to a cap section. The vertical via passes through the cap section, enabling electrical connection to a printed circuit board (PCB) without interference from the trace ring surrounding the RF switch array.

Career Highlights

Joseph S. Hayden, III is currently employed at Intel Corporation, where he continues to push the boundaries of MEMS technology. His work has garnered attention for its innovative approach and practical applications in various electronic devices.

Collaborations

Hayden has collaborated with notable colleagues, including John Heck and Tsung-Kuan Allen Chou. These partnerships have contributed to the development of cutting-edge technologies in the MEMS field.

Conclusion

Joseph S. Hayden, III is a key figure in the advancement of MEMS technology, with a focus on innovative packaging and switching solutions. His contributions have paved the way for future developments in this dynamic field.