Intel Corporation

Steve W Greathouse

John Heck

Jonathan L McFarland

Michele J Berry

Daniel M Wong

Joseph S Hayden, Iii

Eric Gelvin

A MEMS die is bonded to a cap to form a MEMS device. The cap is non-silicon and has an electrical via extending from one side of the cap to another side of the cap. In one embodiment, a plurality of caps is wafer bonded to a plurality of MEMS dice.

MEMS packaging using a non-silicon substrate for encapsulation and interconnection

In one embodiment, the invention provides a method comprising supporting a plurality of active electronic components on a first wafer; shaping a second wafer to define a plurality of spaces, each to accommodate one of the active electronic components when the second wafer is aligned and brought into face-to-face contact with that first wafer in a contact position; moving the second wafer into the contact position; and bonding the second wafer to the first wafer in the contact position.

Wafer-level packaging of electronic devices before singulation

An apparatus and method for collecting compounds from a mold press is described herein. A paper substrate is loaded into a mold press in the same manner as a conventional substrate to collect compounds during set-up, cleaning and/or conditioning cycles. The used paper substrate with the cured compound is then discarded after use. Use of a paper substrate provides significant cost savings over the currently used metal-based substrate.

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Chandler, AZ, United States of America

Steve W Greathouse