Dresden, Germany

Steffen Ziesche

USPTO Granted Patents = 3 

 

Average Co-Inventor Count = 4.8

ph-index = 1

Forward Citations = 3(Granted Patents)


Location History:

  • Dresden, DE (2013 - 2022)
  • Erlangen, DE (2023)

Company Filing History:


Years Active: 2013-2023

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3 patents (USPTO):Explore Patents

Title: Steffen Ziesche: Innovator in Power Semiconductor Technology

Introduction

Steffen Ziesche is a notable inventor based in Dresden, Germany. He has made significant contributions to the field of power semiconductor technology, holding a total of 3 patents. His work focuses on innovative methods for manufacturing power semiconductor components and arrangements.

Latest Patents

Ziesche's latest patents include a method of manufacturing a power semiconductor component arrangement or housing. This method involves a sintering process that converts unsintered ceramic substrates into sintered ceramic layers or interconnect devices. Additionally, he has developed a method for producing components from ceramic materials, which utilizes screen printing or template printing to apply layers of ceramic material in defined geometries. This process allows for the creation of hollow spaces within the layers, enhancing the functionality of the components.

Career Highlights

Throughout his career, Steffen Ziesche has worked with prominent organizations, including the Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. and All-impex GmbH. His experience in these institutions has contributed to his expertise in semiconductor technology and materials science.

Collaborations

Ziesche has collaborated with notable colleagues such as Uwe Partsch and Adrian Goldberg. These partnerships have likely enriched his research and development efforts in the semiconductor field.

Conclusion

Steffen Ziesche's innovative work in power semiconductor technology and his contributions to ceramic materials manufacturing highlight his role as a significant inventor in this domain. His patents reflect a commitment to advancing technology and improving component design.

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