The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 15, 2022
Filed:
Jul. 29, 2016
Fraunhofer-gesellschaft Zur Foerderung Der Angewandten Forschung E.v., Munich, DE;
All-impex Gmbh, Ottendorf-Okrilla, DE;
Uwe Partsch, Dresden, DE;
Adrian Goldberg, Dresden, DE;
Steffen Ziesche, Dresden, DE;
Birgit Manhica, Dresden, DE;
Carolin Lohrberg, Dresden, DE;
Wolfgang Duerfeld, Dresden, DE;
Dietmar Arndt, Radeberg, DE;
Wolfram Kern, Dresden, DE;
FRAUNHOFER-GESELLSCHAFT ZURFÖRDERUNG ANGEWANDTEN FORSCHUNG E. V., Munich, DE;
ALL-IMPEX GMBH, Ottendorf-Okrilla, DE;
Abstract
The invention relates to a method for producing a component from ceramic materials in which a plurality of layers are applied to a base body by means of screen printing or template printing, said layers being formed from a ceramic material, in each case in a defined geometry above one another in the form of a paste or suspension in which powdery ceramic material and at least one binder are included. At least one region is formed here within at least one layer having a defined thickness and geometry composed of a further material that can be removed in a thermal treatment and that is likewise applied in the form of a paste or suspension by means of screen printing or template printing. Electrically functional structures composed of an electrically conductive or semiconductive material are applied to and/or formed on and/or in at least of the ceramic layers prior to the application of a further ceramic layer. The layer structure is then sintered in a thermal heat treatment, with the further material being removed and at least one hollow space being formed with defined dimensions of width, length, and height.