Hong Kong, China

Sri Talpallikar


Average Co-Inventor Count = 2.0

ph-index = 2

Forward Citations = 6(Granted Patents)


Location History:

  • Deer Park, IL (US) (2019)
  • Hong Kong, CN (2014 - 2020)

Company Filing History:


Years Active: 2014-2020

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4 patents (USPTO):Explore Patents

Title: Innovations by Sri Talpallikar

Introduction

Sri Talpallikar is an accomplished inventor based in Hong Kong, CN. He has made significant contributions to the field of thermal management and electromagnetic interference (EMI) solutions for electronic devices. With a total of 4 patents to his name, his work has been instrumental in advancing technology in this area.

Latest Patents

Sri Talpallikar's latest patents include innovative methods of applying thermal interface materials to board level shields. These patents disclose exemplary embodiments of board level shields that incorporate thermal interface materials. Additionally, he has developed solutions for thermal transfer and management, as well as EMI shielding and mitigation for electronic devices. His patents also cover methods for manufacturing components related to these solutions, including techniques such as stamping and drawing.

Career Highlights

Sri Talpallikar is currently employed at Laird Technologies GmbH, where he continues to push the boundaries of innovation in thermal management and EMI solutions. His expertise and dedication to his work have made him a valuable asset to the company.

Collaborations

Some of his notable coworkers include Kelly Cook and Michael Scott Poulsen, who contribute to the collaborative environment that fosters innovation at Laird Technologies GmbH.

Conclusion

Sri Talpallikar's contributions to the field of thermal management and EMI solutions are noteworthy, and his patents reflect his commitment to advancing technology. His work continues to impact the industry positively.

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