The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2020
Filed:
Oct. 13, 2017
Applicant:
Laird Technologies, Inc., Earth City, MO (US);
Inventors:
Sri Talpallikar, Hong Kong, HK;
Jason L. Strader, Cleveland, OH (US);
Assignee:
Laird Technologies, Inc., Chesterfield, MO (US);
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/14 (2006.01); H05K 9/00 (2006.01); H05K 7/20 (2006.01); F28F 13/00 (2006.01); F28F 21/02 (2006.01); F28F 21/08 (2006.01); H01L 23/552 (2006.01); H05K 1/02 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 9/009 (2013.01); B29C 45/14 (2013.01); F28F 13/003 (2013.01); F28F 21/02 (2013.01); F28F 21/084 (2013.01); F28F 21/085 (2013.01); H01L 23/552 (2013.01); H05K 1/0203 (2013.01); H05K 3/3484 (2013.01); H05K 7/20418 (2013.01); H05K 9/0024 (2013.01); H05K 2201/10371 (2013.01);
Abstract
Disclosed are exemplary embodiments of board level shields including thermal interface materials. Also disclosed are methods of applying thermal interface materials to board level shields.