Laird Technologies Gmbh

Sri Talpallikar

Michael Scott Poulsen

Kelly Cook

Jason L Strader

Tomas Hrcek

Thomas Hrcek

Disclosed are exemplary embodiments of board level shields including thermal interface materials. Also disclosed are methods of applying thermal interface materials to board level shields.

Methods of applying thermal interface materials to board level shields

Disclosed are exemplary embodiments of thermal transfer/management and electromagnetic interference (EMI) shielding/mitigation solutions, systems, and/or assemblies for electronic devices. Also disclosed are methods of making or manufacturing (e.g., stamping, drawing, etc.) components of the thermal transfer/management and EMI shielding/mitigation solutions, systems, and/or assemblies.

Thermal transfer/management and EMI shielding/mitigation solutions for electronic devices

A fabric over foam electromagnetic interference gasket has a body of indefinite length, and includes a layer of dielectric material thereon. The gasket may be compressed between two substrates and provide electrical conductivity in one axis and EMI shielding and nonconductivity in a perpendicular axis.

Growing community of inventors

Hong Kong, China

Sri Talpallikar