Suwon, South Korea

Soon-Jin Cho

This inventor holds 5 USPTO granted patents and 2 published patent applications. Top assignee: Samsung Electro-Mechanics Co., Ltd.. Active years: 2009-2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Soon-Jin Cho. Retrieved from https://idiyas.com/inventor/soon-jin-cho-ag3sg5k3

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 5 

% Patents Active = 20.0

Average Co-Inventor Count = 1.9

ph-index = 2

Forward Citations = 17(Granted Patents)


Company Filing History:


Years Active: 2009-2013

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5 patents (USPTO):Explore Patents

Title: Innovations of Soon-Jin Cho in Printed Circuit Board Manufacturing

Introduction

Soon-Jin Cho is a prominent inventor based in Suwon, South Korea. He has made significant contributions to the field of printed circuit board (PCB) manufacturing. With a total of 5 patents to his name, his work has advanced the technology and processes involved in PCB production.

Latest Patents

One of Soon-Jin Cho's latest patents is a printed circuit board manufacturing system and manufacturing method. This invention discloses a method of manufacturing printed circuit boards that includes providing a substrate with a pad and an insulation layer covering the pad. The process involves acquiring an image of the substrate and analyzing it to obtain location information of the pad. A via hole is then formed by removing part of the insulation layer corresponding to the pad's location, followed by filling the via hole with a conductive material. This method improves process conformity, even when the substrate experiences partial or nonlinear deformation, allowing for greater flexibility in substrate design and enhanced integrity for circuitries on the printed circuit board.

Another notable patent by Cho details a method of manufacturing a printed circuit board that includes sequentially stacking an acid-resistant first cover layer and an alkali-resistant second cover layer over a copper foil. The process involves forming an intaglio groove by removing portions of the second cover layer, the first cover layer, and the copper clad laminate. A seed layer is then stacked over the intaglio groove, followed by the removal of a portion of the seed layer and the formation of a plating layer by plating the inside of the intaglio groove. This innovative method enhances the efficiency and effectiveness of PCB manufacturing.

Career Highlights

Soon-Jin Cho is currently employed at Samsung Electro-Mechanics Co., Ltd., where he continues to develop and refine technologies related to printed circuit boards. His expertise and innovative approaches have positioned him as a key figure in the industry.

Collaborations

Throughout his career, Cho has collaborated with notable colleagues, including Chung-Woo Cho and Seok-Hwan Ahn. These partnerships have contributed to the advancement of PCB technologies and have fostered a collaborative environment for innovation.

Conclusion

Soon-Jin Cho's contributions to printed circuit board manufacturing demonstrate his commitment to innovation and excellence in the field. His patents reflect a deep understanding of the complexities involved in PCB production, paving the way

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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